Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497679 | Wafer level package and wafer level chip size package | Masakazu Fukumitsu | 2019-12-03 |
| 10440868 | Rotary head for component mounting device | Masataka Iwasaki, Takeshi Fujishiro | 2019-10-08 |