Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497679 | Wafer level package and wafer level chip size package | Shuhei Yamada | 2019-12-03 |
| 10374569 | Resonance device and manufacturing method therefor | Keiichi Umeda, Takehiko Kishi, Hiroshi Yamada | 2019-08-06 |