Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431458 | Mask shrink layer for high aspect ratio dielectric etch | Eric A. Hudson, Mark Wilcoxson, Hyunjong Shim, Merrett Wong | 2019-10-01 |
| 10170323 | Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch | Eric A. Hudson, Mark Wilcoxson, Hyung Joo Shin | 2019-01-01 |