Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361177 | Semiconductor package having a molding layer including a molding cavity and method of fabricating the same | Pyoungwan Kim, Hyunki Kim, Junwoo Park, Sangsoo Kim, Seung Hwan Kim +2 more | 2019-07-23 |
| 10234567 | Location awareness apparatus, vehicle having the same and method for controlling the apparatus | — | 2019-03-19 |