Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361177 | Semiconductor package having a molding layer including a molding cavity and method of fabricating the same | Yun Young Kim, Pyoungwan Kim, Hyunki Kim, Junwoo Park, Seung Hwan Kim +2 more | 2019-07-23 |
| 10347859 | Organic light emitting device | Yeonhwa Lee, Duckjung Lee, Joongu Lee, Sehoon Jeong, Jiyoung Choung | 2019-07-09 |