Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10470315 | Manufacturing method of test socket and test method for semiconductor package | Daisuke Yamada, Jae-Ho Song, Dong-uhn Shin | 2019-11-05 |
YM
Young-gi Min
Overall (2019): #210,104 of 560,194Top 40%
1
Patents 2019