Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10470315 | Manufacturing method of test socket and test method for semiconductor package | Daisuke Yamada, Young-gi Min, Dong-uhn Shin | 2019-11-05 |
| 10256368 | Semiconductor substrate for controlling a strain | Jung-Hyun Eum, Kwang Yong Choi, Dong-Kun Lee, Kye-Jin Lee, Young Jae Choi | 2019-04-09 |