Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431536 | Interposer substrate and semiconductor package | Hyon-chol Kim, Bok-Sik Myung | 2019-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431536 | Interposer substrate and semiconductor package | Hyon-chol Kim, Bok-Sik Myung | 2019-10-01 |