Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431536 | Interposer substrate and semiconductor package | Bok-Sik Myung, Ok-Gyeong Park | 2019-10-01 |
HK
Hyon-chol Kim
Overall (2019): #438,459 of 560,194Top 80%
1
Patents 2019