Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410990 | Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus | Man-hee Han, Dae-Sang Chan, Sung-Il Cho | 2019-09-10 |