DC

Dae-Sang Chan

Samsung: 1 patents #6,950 of 16,573Top 45%
Overall (2019): #499,532 of 560,194Top 90%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10410990 Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus Man-hee Han, Sung-Il Cho, Jung Lae Jung 2019-09-10