Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354936 | Electronic component having a heat dissipation member formed on a sealing member | Yusuke Harada | 2019-07-16 |
| 10304633 | Chip capacitor and method for manufacturing the same | Hiroyuki Okada | 2019-05-28 |
| 10297468 | Semiconductor device with recess and method of making | Yuichi Nakao | 2019-05-21 |
| 10279597 | Thermal print head | Isamu Nishimura | 2019-05-07 |
| 10249514 | Semiconductor device and manufacturing method thereof | — | 2019-04-02 |
| 10224391 | Chip resistor and electronic equipment having resistance circuit network | Hiroshi Tamagawa, Yasuhiro Kondo, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura | 2019-03-05 |