Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10470310 | Electronic component and a method for manufacturing an electronic component | — | 2019-11-05 |
| 10410944 | Semiconductor device | — | 2019-09-10 |
| 10347550 | Semiconductor package and method of making the same | — | 2019-07-09 |
| 10279597 | Thermal print head | Yasuhiro Fuwa | 2019-05-07 |