Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508349 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides | Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Joanna Dziewiszek | 2019-12-17 |
| 10508357 | Method of filling through-holes to reduce voids and other defects | Nagarajan Jayaraju, Leon Barstad, Joanna Dziewiszek | 2019-12-17 |
| 10196751 | Nitrogen containing polymers as levelers | Lingli Duan, Chen Chen, Tong Sun, Maria Anna Rzeznik | 2019-02-05 |
| 10201097 | Polymers containing benzimidazole moieties as levelers | Lingli Duan, Yang Li, Tong Sun, Shaoguang Feng, Chen Chen +1 more | 2019-02-05 |
| 10190226 | Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens | Julia Kozhukh | 2019-01-29 |
| 10190228 | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features | Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Joanna Dziewiszek | 2019-01-29 |