Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508349 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides | Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra I. Niazimbetova | 2019-12-17 |
| 10508357 | Method of filling through-holes to reduce voids and other defects | Nagarajan Jayaraju, Leon Barstad, Zuhra I. Niazimbetova | 2019-12-17 |
| 10190228 | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features | Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra I. Niazimbetova | 2019-01-29 |