Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490532 | Apparatus and method for direct transfer of semiconductor devices | Andrew Huska, Cody Peterson, Clinton Adams | 2019-11-26 |
| 10373937 | Apparatus for multi-direct transfer of semiconductors | Andrew Huska, Cody Peterson, Clinton Adams | 2019-08-06 |
| 10354895 | Support substrate for transfer of semiconductor devices | Andrew Huska, Cody Peterson, Clinton Adams | 2019-07-16 |
| 10325885 | Semiconductor device on string circuit and method of making the same | Andrew Huska, Cody Peterson, Clinton Adams | 2019-06-18 |
| 10290615 | Method and apparatus for improved direct transfer of semiconductor die | Andrew Huska, Cody Peterson, Clinton Adams | 2019-05-14 |
| 10242971 | Apparatus for direct transfer of semiconductor devices with needle retraction support | Andrew Huska, Cody Peterson, Clinton Adams | 2019-03-26 |
| 10170454 | Method and apparatus for direct transfer of semiconductor device die from a mapped wafer | Andrew Huska, Cody Peterson, Clinton Adams | 2019-01-01 |