Issued Patents 2019
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490532 | Apparatus and method for direct transfer of semiconductor devices | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-11-26 |
| 10475358 | Indicium illumination by light-generating sources | Cody Peterson | 2019-11-12 |
| 10471545 | Top-side laser for direct transfer of semiconductor devices | Justin Wendt, Cody Peterson | 2019-11-12 |
| 10410905 | Method and apparatus for direct transfer of multiple semiconductor devices | Cody Peterson | 2019-09-10 |
| 10381176 | Keyboard backlighting with deposited light-generating sources | Cody Peterson, Kasey Christie, Clinton Adams | 2019-08-13 |
| 10373937 | Apparatus for multi-direct transfer of semiconductors | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-08-06 |
| 10361176 | Substrate with array of LEDs for backlighting a display device | Cody Peterson | 2019-07-23 |
| 10354895 | Support substrate for transfer of semiconductor devices | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-07-16 |
| 10325885 | Semiconductor device on string circuit and method of making the same | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-06-18 |
| 10309589 | Light vectoring apparatus | Cody Peterson, Monica Hansen, Justin Wendt, Clint Adams | 2019-06-04 |
| 10297478 | Method and apparatus for embedding semiconductor devices | Cody Peterson, Justin Wendt | 2019-05-21 |
| 10290615 | Method and apparatus for improved direct transfer of semiconductor die | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-05-14 |
| 10242971 | Apparatus for direct transfer of semiconductor devices with needle retraction support | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-03-26 |
| 10203627 | Electrophotographic deposition of unpackaged semiconductor device | Orin M. Ozias, Cody Peterson, Clinton Adams, Kasey Christie | 2019-02-12 |
| 10193031 | Method for applying phosphor to light emitting diodes and apparatus thereof | Cody Peterson, Clinton Adams, Monica Hansen | 2019-01-29 |
| 10170454 | Method and apparatus for direct transfer of semiconductor device die from a mapped wafer | Cody Peterson, Clinton Adams, Sean Kupcow | 2019-01-01 |