Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475664 | Wafer stacking to form a multi-wafer-bonded structure | Andrew Cahill, Jonathan Getty, Paul A. Drake | 2019-11-12 |
| 10300649 | Enhancing die flatness | Andrew Cahill, Sean F. Harris | 2019-05-28 |