Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475664 | Wafer stacking to form a multi-wafer-bonded structure | Jonathan Getty, Daniel D. Lofgreen, Paul A. Drake | 2019-11-12 |
| 10300649 | Enhancing die flatness | Sean F. Harris, Daniel D. Lofgreen | 2019-05-28 |