Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431549 | Semiconductor package and manufacturing method thereof | Chien-Wen Huang, Chia-Wei Chiang, Wen-Jeng Fan | 2019-10-01 |
| 10276510 | Manufacturing method of package structure having conductive shield | Chia-Wei Chiang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2019-04-30 |