Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276510 | Manufacturing method of package structure having conductive shield | Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu | 2019-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276510 | Manufacturing method of package structure having conductive shield | Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu | 2019-04-30 |