Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10469718 | Camera module having baffle between two glass substrates | Wei-Ping Chen | 2019-11-05 |
| 10455131 | Wafer-level methods for packing camera modules, and associated camera modules | Wei-Ping Chen | 2019-10-22 |
| 10437025 | Wafer-level lens packaging methods, and associated lens assemblies and camera modules | Wei-Ping Chen, Jui-Yi Chiu, Jau-Jan Deng | 2019-10-08 |
| 10333277 | Structure light module using vertical cavity surface emitting laser array | Wei-Ping Chen | 2019-06-25 |