Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10437025 | Wafer-level lens packaging methods, and associated lens assemblies and camera modules | Tsung-Wei Wan, Wei-Ping Chen, Jau-Jan Deng | 2019-10-08 |
| 10418395 | Methods of forming image sensor integrated circuit packages | — | 2019-09-17 |