Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431476 | Method of making a plurality of packaged semiconductor devices | Antonius Hendrikus Jozef Kamphuis, Jan Gulpen | 2019-10-01 |
| 10177111 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes | 2019-01-08 |