Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10315821 | Component carrier | Jeroen Johannes Maria Zaal, Roelf Anco Jacob Groenhuis, Leo van Gemert | 2019-06-11 |
| 10177111 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2019-01-08 |