Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453787 | Method and apparatus for forming multi-layered vias in sequentially fabricated circuits | Maurice S. Karpman, Gary B. Tepolt, Russell Berman | 2019-10-22 |
| 10418249 | Method and apparatus for using universal cavity wafer in wafer level packaging | Maurice S. Karpman, Michael Rickley, Andrew J. Mueller, Jeffrey C. Thompson, Charles Baab | 2019-09-17 |