Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453787 | Method and apparatus for forming multi-layered vias in sequentially fabricated circuits | Nicole Mueller, Gary B. Tepolt, Russell Berman | 2019-10-22 |
| 10418249 | Method and apparatus for using universal cavity wafer in wafer level packaging | Michael Rickley, Andrew J. Mueller, Nicole Mueller, Jeffrey C. Thompson, Charles Baab | 2019-09-17 |
| 10315914 | Reconstructed wafer based devices with embedded environmental sensors and process for making same | — | 2019-06-11 |
| 10265516 | Closely spaced array of penetrating electrodes | Andrew Meuller | 2019-04-23 |