Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10262951 | Radiation hardened microelectronic chip packaging technology | Jin Ho Kang, Godfrey Sauti, Cheol Park, Sheila A. Thibeault, Sharon E. Lowther +1 more | 2019-04-16 |
LG
Luke Gibbons
National Institute Of Aerospace Associates: 1 patents #5 of 10Top 50%
Overall (2019): #368,804 of 560,194Top 70%
1
Patents 2019