Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513080 | Method for the free form fabrication of articles out of electrically conductive filaments using localized heating | Jae-Woo Kim, John M. Gardner, Emilie J. Siochi | 2019-12-24 |
| 10500836 | Adhesion test station in an extrusion apparatus and methods for using the same | Jae-Woo Kim, Emilie J. Siochi, John M. Gardner, Christopher J. Stelter | 2019-12-10 |
| 10435293 | Methods of manufacturing energy conversion materials fabricated with boron nitride nanotubes (BNNTs) and BNNT polymer composites | Jin Ho Kang, Cheol Park, Joycelyn S. Harrison, Michael W. Smith, Sharon E. Lowther +1 more | 2019-10-08 |
| 10262951 | Radiation hardened microelectronic chip packaging technology | Jin Ho Kang, Cheol Park, Luke Gibbons, Sheila A. Thibeault, Sharon E. Lowther +1 more | 2019-04-16 |