Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418240 | Nitride semiconductor structure | Kun-Chuan Lin, Jin-Hsiang Liu | 2019-09-17 |
| 10312169 | Substrate and package module including the same | Yu-Shiang CHEN, Chao-Wei Yu, Ming-Te Tu | 2019-06-04 |
| 10287386 | Core-shell particle, method of manufacturing the same and applications thereof | Yu-Huei Su, Wen-Yen Chiu, Chi-An Dai, Chen-Han Yang, Bo-Ting Chou | 2019-05-14 |