Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396234 | Package structure of long-distance sensor and packaging method of the same | Ching-I Lin | 2019-08-27 |
| 10362377 | MEMS microphone package | Hsien-Ken Liao, Jyong-Yue Tian, Yao-Ting YEH | 2019-07-23 |
| 10362406 | MEMS microphone package | Yao-Ting YEH, Hsien-Ken Liao, Jyong-Yue Tian | 2019-07-23 |
| 10312169 | Substrate and package module including the same | Yu-Shiang CHEN, Chao-Wei Yu, Yu-Lin Hsiao | 2019-06-04 |
| 10299046 | MEMS microphone package | Hsien-Ken Liao, Jyong-Yue Tian, Yao-Ting YEH | 2019-05-21 |