Issued Patents 2019
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446514 | Combing bump structure and manufacturing method thereof | Chin-Lung Chu | 2019-10-15 |
| 10438887 | Semiconductor chip and multi-chip package using thereof and method for manufacturing the same | — | 2019-10-08 |
| 10431559 | Method for manufacturing a semiconductor structure | — | 2019-10-01 |
| 10373932 | Stacked semiconductor structure | Chin-Lung Chu | 2019-08-06 |
| 10361171 | Stacked package structure and manufacturing method thereof | — | 2019-07-23 |
| 10290512 | Semiconductor structure having bump on tilting upper corner surface | Chin-Lung Chu | 2019-05-14 |
| 10256179 | Package structure and manufacturing method thereof | — | 2019-04-09 |
| 10229877 | Semiconductor chip and multi-chip package using thereof | — | 2019-03-12 |
| 10192853 | Method for preparing a semiconductor apparatus | Chin-Lung Chu | 2019-01-29 |
| 10192841 | Semiconductor package and method for preparing the same | — | 2019-01-29 |
| 10170339 | Semiconductor structure and a manufacturing method thereof | — | 2019-01-01 |
| 10170432 | Semiconductor structure | Chin-Lung Chu | 2019-01-01 |
| 10170340 | Semiconductor structure | — | 2019-01-01 |