Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446514 | Combing bump structure and manufacturing method thereof | Po-Chun Lin | 2019-10-15 |
| 10373932 | Stacked semiconductor structure | Po-Chun Lin | 2019-08-06 |
| 10290512 | Semiconductor structure having bump on tilting upper corner surface | Po-Chun Lin | 2019-05-14 |
| 10192853 | Method for preparing a semiconductor apparatus | Po-Chun Lin | 2019-01-29 |
| 10170432 | Semiconductor structure | Po-Chun Lin | 2019-01-01 |