Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410882 | Solder bond site including an opening with discontinuous profile | Jaspreet S. Gandhi | 2019-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410882 | Solder bond site including an opening with discontinuous profile | Jaspreet S. Gandhi | 2019-09-10 |