Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504749 | Semiconductor device | Shuji Nishimoto | 2019-12-10 |
| 10497637 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-12-03 |
| 10497585 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-12-03 |
| 10453783 | Power module substrate | Toyo Ohashi | 2019-10-22 |
| 10410951 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-09-10 |
| 10375825 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Kimihito Nishikawa, Yoshirou Kuromitsu | 2019-08-06 |
| 10370303 | Process for producing bonded body and process for producing power module substrate | Nobuyuki Terasaki | 2019-08-06 |
| 10319664 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-06-11 |
| 10283431 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Nobuyuki Terasaki | 2019-05-07 |
| 10199237 | Method for manufacturing bonded body and method for manufacturing power-module substrate | Nobuyuki Terasaki | 2019-02-05 |
| 10173282 | Bonded body and power module substrate | Nobuyuki Terasaki | 2019-01-08 |