Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497637 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-12-03 |
| 10497585 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-12-03 |
| 10410951 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-09-10 |
| 10370303 | Process for producing bonded body and process for producing power module substrate | Yoshiyuki Nagatomo | 2019-08-06 |
| 10375825 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu | 2019-08-06 |
| 10319664 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-06-11 |
| 10283431 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Yoshiyuki Nagatomo | 2019-05-07 |
| 10199237 | Method for manufacturing bonded body and method for manufacturing power-module substrate | Yoshiyuki Nagatomo | 2019-02-05 |
| 10173282 | Bonded body and power module substrate | Yoshiyuki Nagatomo | 2019-01-08 |