Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354864 | Compound semiconductor substrate with SiC layer | Mitsuhisa Narukawa, Akira Fukazawa, Hiroki Suzuki | 2019-07-16 |
| 10253843 | Vibration reduction apparatus of hybrid vehicle | Masato Shigenaga | 2019-04-09 |
| 10186421 | Composite semiconductor substrate | Akira Fukazawa, Mitsuhisa Narukawa | 2019-01-22 |