Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354864 | Compound semiconductor substrate with SiC layer | Mitsuhisa Narukawa, Hiroki Suzuki, Keisuke Kawamura | 2019-07-16 |
| 10186421 | Composite semiconductor substrate | Mitsuhisa Narukawa, Keisuke Kawamura | 2019-01-22 |
| 10186585 | Semiconductor device and method for manufacturing the same | Sumito OUCHI | 2019-01-22 |