Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410879 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2019-09-10 |
| 10262922 | Semiconductor device having through-silicon-via and methods of forming the same | Jaspreet S. Gandhi | 2019-04-16 |