Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10416192 | Cantilever microprobes for contacting electronic components | Richard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Pavel B. Lembrikov | 2019-09-17 |
| 10215775 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2019-02-26 |