Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297421 | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures | Adam L. Cohen | 2019-05-21 |
| 10215775 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2019-02-26 |