Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490511 | Microelectronic assembly with electromagnetic shielding | Ruey-Bo Sun | 2019-11-26 |
| 10446508 | Semiconductor package integrated with memory die | Sheng-Mou Lin, Chih-Chun Hsu | 2019-10-15 |