Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446508 | Semiconductor package integrated with memory die | Sheng-Mou Lin, Wen-Chou Wu | 2019-10-15 |
| 10340235 | Semiconductor package with three-dimensional antenna | Sheng-Mou Lin | 2019-07-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446508 | Semiconductor package integrated with memory die | Sheng-Mou Lin, Wen-Chou Wu | 2019-10-15 |
| 10340235 | Semiconductor package with three-dimensional antenna | Sheng-Mou Lin | 2019-07-02 |