Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446498 | Isolation between semiconductor components | John Constantino, Timwah Luk, Robert L. Krause, Etan Shacham, Maria Clemens Y. Quinones +2 more | 2019-10-15 |
| 10304758 | Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active wafer | Karthik Thambidurai, Viresh Piyush Patel, Viren Khandekar | 2019-05-28 |
| 10171910 | Methods and devices for reproducing stereo audio | — | 2019-01-01 |