Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304758 | Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active wafer | Karthik Thambidurai, Ahmad Ashrafzadeh, Viren Khandekar | 2019-05-28 |