Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431530 | Power semiconductor module and method for manufacturing the same | Jae Sik Choi, Jun Young Heo, Moon Taek Sung, Dong Seong Oh | 2019-10-01 |
| 10347565 | Multi-chip package of power semiconductor | Jae Sik Choi, Myung Ho Park, Dong Seong Oh, Beom Su Kim | 2019-07-09 |
| 10269677 | Semiconductor package and a method of manufacturing the same | Jae Sik Choi, Dong Seong Oh | 2019-04-23 |