Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347565 | Multi-chip package of power semiconductor | Si Hyeon Go, Jae Sik Choi, Dong Seong Oh, Beom Su Kim | 2019-07-09 |
| 10276673 | Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon | Ui Kyu Seo, Young Ho Seo, Jae Sik Choi | 2019-04-30 |