Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325850 | Ground pattern for solderability and radio-frequency properties in millimeter-wave packages | Emmanuelle R. O. Convert, Ryan M. Clement, Simon J. Mahon | 2019-06-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325850 | Ground pattern for solderability and radio-frequency properties in millimeter-wave packages | Emmanuelle R. O. Convert, Ryan M. Clement, Simon J. Mahon | 2019-06-18 |