Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325850 | Ground pattern for solderability and radio-frequency properties in millimeter-wave packages | Ryan M. Clement, Simon J. Mahon, Leif G. M. Snygg | 2019-06-18 |
| 10211780 | Alternating anti-parallel diode mixer structure | Simon J. Mahon, James T. Harvey | 2019-02-19 |