Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497635 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, Frederick E. Beville, Michael J. Anderson, Yucheng Ying | 2019-12-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497635 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, Frederick E. Beville, Michael J. Anderson, Yucheng Ying | 2019-12-03 |